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Innovative process for material separation of printed circuit boards (PCB) with laser technology
mehr| Titel | Innovative process for material separation of printed circuit boards (PCB) with laser technology |
|---|---|
| Medien | IOP Conference Series: Materials Science and Engineering |
| Band | 1235 |
| Verfasser | Markus Zink, Prof. Dr.-Ing. Alexandru Sover, T Vogel |
| Seiten | 102009 |
| Veröffentlichungsdatum | 31.01.2022 |
| Zitation | Zink, Markus; Sover, Alexandru; Vogel, T (2022): Innovative process for material separation of printed circuit boards (PCB) with laser technology. IOP Conference Series: Materials Science and Engineering 1235, 102009. DOI: 10.1088/1757-899x/1235/1/012009 |